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首页> 外文会议>17th CIRP International Conference on Life Cycle Engineering(国际生产工程科学院（ICRP)第17届生命周期工程会议 LCE 2010) >Development and Application of Unsoldering Equipment for Printed Circuit Boards' Scraps
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Development and Application of Unsoldering Equipment for Printed Circuit Boards' Scraps

机译：印刷电路板废料拆焊设备的开发与应用

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摘要

The realization of electronic components' nondestructive unsoldering sepamtion from PCB scraps has ever been a tough challenge for eletronic and electrical products’recycling.According to the PCBs' structural feature，based on the analysis and comparison of existing unsoldering methods，liquid solder tin is selected to heat and melt the solders of PCB scraps，and the mechanical impact and vibration are used to achieve the electronic components' unsoldering purpose.The mechanical structure layout and the control system composition of the unsoldering equipment are given in the paper.The unsoldering process is introduced in detail.and the gasses and dusts generatad in the procedure of unsoldering are collected and disposed properly.Finally the unsoldering prototype is developed and put to use in a recycling demonstrating line of electrical home appliances.Practice shows that the equipment has advantages of efficiency，safety，reliability，energy-saving and environmental protection，moreover，the damage rate of the electronic components is low.
机译：从PCB废料实现电子元件的无损拆焊分离一直是电子电气产品回收的艰巨挑战。根据PCB的结构特点，在对现有拆焊方法进行分析和比较的基础上，选择了液态焊锡对PCB废料进行加热和熔化，并通过机械冲击和振动来达到电子元器件拆焊的目的。本文给出了拆焊设备的机械结构布局和控制系统组成。最后介绍了拆焊样机，并开发了拆焊样机，并将其用于家用电器的循环利用示范生产线。实践表明，该设备具有效率高的优点。 ，安全，可靠，节能环保保护，此外，电子元件的损坏率低。

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