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首页> 外文会议>2001 ASME Design Engineering Technical Conferences and Computers and Information in Engineering Conference Vol.2: 27th Design Automation Conference, 2001, 2001 >ADAPTIVE SLICING FOR A FIVE-AXIS LASER AIDED MANUFACTURING PROCESS
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ADAPTIVE SLICING FOR A FIVE-AXIS LASER AIDED MANUFACTURING PROCESS

机译：五轴激光辅助制造过程的自适应切片

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摘要

The Laser Aided Manufacturing Process (LAMP) is an additive process similar to laser cladding. It can produce fully functional parts because the process is material independent. The traditional layered manufacturing (LM) processes with fixed build direction have a limited surface accuracy and their build time is often long due to the deposition of sacrificial support structure. The multiple degrees of freedom allow the LAMP system to build a part without support structure and with better surface quality; however, an automated method for path planning of such a multi-axis system is necessary. An algorithm of adaptive slicing for five-axis LAMP is presented in this paper, which can generate optimal slices to achieve deposition without support structures. Different from the current adaptive slicing, this technique varies not only in layer thickness but also in slicing direction. The slicing direction is determined by a marching algorithm, which is based on the surface normal of points on the side surface of the current slice. Two techniques are adapted to build the overhang between two adjacent layers: thin wall deposition and direct overhang deposition based on surface tension.
机译：激光辅助制造工艺（LAMP）是类似于激光熔覆的附加工艺。它可以生产功能齐全的零件，因为该过程与材料无关。具有固定构建方向的传统分层制造（LM）工艺的表面精度有限，并且由于牺牲支撑结构的沉积，其构建时间通常很长。多种自由度使LAMP系统无需支撑结构即可制造零件，并具有更好的表面质量；然而，用于这种多轴系统的路径规划的自动化方法是必需的。提出了一种适用于五轴LAMP的自适应切片算法，该算法可以生成最佳切片来实现无支撑结构的沉积。与当前的自适应切片不同，该技术不仅在层厚度上而且在切片方向上都不同。切片方向由行进算法确定，该算法基于当前切片侧面上的点的表面法线。两种技术适用于在两个相邻层之间建立悬垂：薄壁沉积和基于表面张力的直接悬垂沉积。

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