It is difficult to produce complex powder metal (P/M) components using conventional P/M technology. However, with hot isostatic pressing (HIP) it is possible to "assemble" a complex P/M component by HIP bonding pre-consolidated P/M shapes. This study explores the process of HIP bonding solid P/M duplex 2205. Experimentation quantifies the effect of a duplex 2205-powder interlayer on bond strength. Tensile results of bonded samples with a powder interlayer are compared to bonded samples without an interlayer, as well as solid P/M samples. Results show little difference between samples bonded with or without a powder interlayer. Furthermore, the tensile properties of both types of bonds are identical to that of solid stock P/M duplex 2205. Microscopy of the bond surfaces shows little difference in the level of inclusions or the quality of the bond.
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