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首页> 外文会议>2003 TMS Annual Meeting Mar 2-6, 2003 San Diego, California >MICROSTRUCTURE EVOLUTION IN A1-3CU ALLOY DURING INTENSE PLASTIC STRAINING AT 150℃
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MICROSTRUCTURE EVOLUTION IN A1-3CU ALLOY DURING INTENSE PLASTIC STRAINING AT 150℃

机译：150℃强化塑性应变过程中A1-3％CU合金的组织演变

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摘要

The microstructure evolution during intense plastic straining in an Al-3%Cu alloy was examined by metallographic technique and transmission electron microscopy. Samples were subjected to equal channel angular extrusion up to true strains ranging from 1 to 8 at T=150℃. It was shown that low energy dislocation structure consisting of microbands and dense dislocation walls is evolved afterε=1. Following strain results in the formation of elongated subgrains owing to transformation of dense dislocation walls into subgrain boundaries. Low-angle boundaries convert into high-angle boundaries with further strain and crystallite become essentially equiaxed. As a result, recrystallized grains were found at ε=4. At ε=8, the volume fraction of recrystallized grains is about 50 pct. Mechanism of fine grain formation is discussed.
机译：通过金相技术和透射电子显微镜检查了Al-3％Cu合金在剧烈塑性应变过程中的显微组织演变。在T = 150℃下，样品经受等通道角挤压，直至达到1至8的真实应变。结果表明，ε＝ 1后，形成了由微带和致密位错壁组成的低能位错结构。紧随应变之后，由于致密位错壁转变为亚晶界，导致拉长的亚晶形成。低角度边界随着进一步的应变转换成高角度边界，并且微晶基本等轴。结果，发现重结晶晶粒为ε＝ 4。在ε＝ 8，重结晶晶粒的体积分数约为50％。探讨了细晶粒形成的机理。

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