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首页> 外文会议>2011 IEEE International Ultrasonics Symposium >A 48 MHz, hermetic, 0.48 mm2 chip-scale packaged USB3.0 oscillator integrating an FBAR resonator with CMOS circuitry
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A 48 MHz, hermetic, 0.48 mm2 chip-scale packaged USB3.0 oscillator integrating an FBAR resonator with CMOS circuitry

机译：集成了FBAR谐振器和CMOS电路的48MHz密封式0.48 mm 2 芯片级封装USB3.0振荡器

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摘要

Most ASIC (Application Specific Integrated Circuits) chips have a common need for clocking. The clock is usually supplied by the end-user of the ASIC chip and consists of a quartz crystal resonator, two precision capacitors, and an on-chip inverter driver. An ASIC supplier that can integrate the clock inside their package will have a product differentiator relative to their competitors. We demonstrate a zero drift FBAR Resonator (ZDR) with a native Q of 3000 and a temperature stability of ±50 ppm integrated with a CMOS oscillator core, all bias circuitry, oscillator buffer, dividers, and output buffer. The 0.6µm node CMOS circuitry is integrated in the silicon lid of the microcapped device. Since many thousands of packaged die are created on each wafer, one can take a significant amount of statistics on the effect of frequency shift due to environmental stress (HAST, Autoclave, thermal shock). This allows us to accurately quantify aging effects as well as the most likely forms of device failures in the field.
机译：大多数ASIC（专用集成电路）芯片对时钟都有共同的需求。时钟通常由ASIC芯片的最终用户提供，由一个石英晶体谐振器，两个精密电容器和一个片上逆变器驱动器组成。可以将时钟集成到其封装中的ASIC供应商将具有相对于竞争对手的产品差异化。我们演示了零漂移FBAR谐振器（ZDR），其固有Q为3000，温度稳定性为±50 ppm，与CMOS振荡器内核，所有偏置电路，振荡器缓冲器，分频器和输出缓冲器集成在一起。 0.6µm节点CMOS电路集成在微封顶器件的硅盖中。由于在每个晶片上创建了成千上万个封装管芯，因此可以对由于环境压力（HAST，高压灭菌器，热冲击）引起的频率偏移的影响进行大量统计。这使我们能够准确地量化老化效应以及现场设备故障的最可能形式。

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