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Integration of high sheet resistance homogeneous emitters in a process flow for PERC-type solar cells with Cu contacts

机译:高薄层电阻均质发射极在带有Cu触点的PERC型太阳能电池的工艺流程中的集成

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This paper presents the results of the integration of a high sheet resistance (120 Ω/sq) homogeneous emitter with an industrial feasible process flow on large area p-type CZ-Si PERC solar cells with plated Ni-Si/Cu front contacts. Focus is put on the junction isolation performed by either applying a mask prior to POCl3 diffusion or by selectively removing the rear side emitter in an inline 1-sided wet-chemical etching tool after diffusion. A metallization sequence [1,2] applying Ni and Cu plating, is performed to contact the moderately doped emitters. The best experimental split in this comparison resulted in excellent average conversion efficiency of 20.2%.
机译:本文介绍了在镀有Ni-Si / Cu前触点的大面积p型CZ-Si PERC太阳能电池上集成了高薄层电阻(120Ω/ sq)均匀发射极和工业可行工艺流程的结果。重点放在结隔离上,方法是在POCl3扩散之前涂上掩模,或在扩散后通过在线1面湿式化学蚀刻工具有选择地去除背面发射极。进行应用镍和铜电镀的金属化顺序[1,2],以接触中等掺杂的发射极。在此比较中,最佳的实验拆分产生了20.2%的出色平均转化效率。

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