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首页> 外文会议>2013 8th International Design and Test Symposium >Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress
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Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress

机译：通过玻璃进行热力学分析：几何参数对热应力的影响

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摘要

As the request for high preferment and reliable 3D Integrated Circuit (IC) packages is increasing. Investigations in this technology are accelerating with the aim to reduce both cost and size. Glass interposer is recently used in this domain, it represents an effective alternative to the silicon due to its low cost, ease manufacturing and low electrical parasitic effects and cross talk. Although, the study of the reliability of the Through Glass Via (TGV) and its most critical stress areas remains a major concern. This study is about the thermal stress simulation in the glass interposer used in a three dimensional (3D) miniaturized camera package, in which we are using the Finite Element Analysis (FEA) method within ANSYS software to analyze the thermal stress concentration areas and inspect the geometric parameters effect on the resulting stress in a single TGV 3D model. Results are relevant to the boundary conditions and material properties used through all simulations. This work can be implemented to optimize via geometry and the whole glass interposer used in the 3D packaging technology.
机译：随着对高首选和可靠的3D集成电路（IC）封装的需求不断增长。为了减少成本和尺寸，该技术的研究正在加速。玻璃中介层最近在此领域中使用，由于它的低成本，易于制造以及较低的电气寄生效应和串扰，它是硅的有效替代品。虽然，对玻璃通孔（TGV）及其最关键的应力区域的可靠性的研究仍然是一个主要问题。这项研究是关于在三维（3D）微型相机封装中使用的玻璃中介层中的热应力模拟，其中我们正在ANSYS软件中使用有限元分析（FEA）方法来分析热应力集中区域并检查几何参数会在单个TGV 3D模型中影响所产生的应力。结果与所有模拟使用的边界条件和材料特性有关。可以实施这项工作以优化3D封装技术中使用的几何形状和整个玻璃中介层。

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