首页> 外文会议>2013 Computational Electromagnetics Workshop >Hybrid electromagnetic modeling of non-contact probes for terahertz device characterization
【24h】

Hybrid electromagnetic modeling of non-contact probes for terahertz device characterization

机译:非接触式探头的混合电磁建模,用于太赫兹器件表征

获取原文
获取原文并翻译 | 示例

摘要

We present a hybrid full-wave/quasi-optical electromagnetic model for the design of lens-integrated THz antennas for high frequency non-contact device characterization (0.1–3 THz). The new non-contact probe setup consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available THz-frequency extension modules are used in conjunction with microwave vector network analyzers to excite the probes. A hemispherical lens couples the signals into device-under-test using the on-chip antennas. To maximize antenna-to-device coupling over a wide bandwidth, we developed a hybrid electromagnetic model to optimize the THz antenna topology. This paper is focused on the system level computational analysis of the probe structure. The overall signal coupling performance of the non-contact probe is analyzed in a hybrid fashion by propagating the antenna fields computed from the moment method throughout the quasi-optical system.
机译:我们提出了用于透镜集成太赫兹天线设计的全波/准光学混合电磁模型,用于高频非接触式设备表征(0.1–3 THz)。新的非接触式探头设置包括在共面波导环境中的片上接收和发射THz天线。商用THz频率扩展模块与微波矢量网络分析仪配合使用可激发探头。半球形透镜使用片上天线将信号耦合到被测设备中。为了在宽带宽上最大化天线与设备的耦合,我们开发了一种混合电磁模型来优化THz天线拓扑。本文着重于探针结构的系统级计算分析。通过在整个准光学系统中传播由矩量法计算得出的天线场,以混合方式分析了非接触式探头的整体信号耦合性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号