ZnO nanowires lift-off from silicon substrate embedded in flexible films

机译：ZnO纳米线从嵌入柔性膜中的硅基底剥离

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A novel lifting-off method of ZnO nanowires from Si substrate and embedded in flexible films have been proposed in this study. Compared with peeling-off method by polydimethyl- siloxane (PDMS), the embedded ZnO nanowires may suffer from external forces to change the dimension. The shape of ZnO nanowires remained almost unchanged after using the novel lifting-off process. Flexible films served as the secondary and flexible substrate after ZnO nanowires transferring from the Si substrate. The lift-off fabrication is a candidate for Si substrate recycling usage and for large area fabrication.

机译：本研究提出了一种新的从硅衬底上剥离并嵌入柔性膜中的ZnO纳米线的方法。与通过聚二甲基硅氧烷（PDMS）剥离的方法相比，嵌入的ZnO纳米线可能会受到外力改变尺寸的影响。使用新颖的剥离工艺后，ZnO纳米线的形状几乎保持不变。在ZnO纳米线从Si衬底转移后，柔性膜充当第二和柔性衬底。剥离制造是用于Si衬底回收利用和大面积制造的候选者。

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来源
《2013 IEEE 5th International Nanoelectronics Conference.》|2013年|p.1-3|共3页
会议地点 Singapore(SG);Singapore(SG)
作者
Horng Ray-Hua; Lin Hung-I; Wuu Dong-Sing;
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作者单位

Institute Graduate of Precision Engineering, National Chung Hsing University, Taichung 40227, Taiwan, Republic of China;

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会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;微电子学、集成电路（IC）;
关键词
PDMS; ZnO; lift-off and flexible film; nanowires;

机译：PDMS; ZnO;剥离软膜;纳米线;;

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4. ZnO nanowires lift-off from silicon substrate embedded in flexible films [C] . Horng Ray-Hua, Lin Hung-I, Wuu Dong-Sing IEEE International Nanoelectronics Conference . 2013

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ZnO nanowires lift-off from silicon substrate embedded in flexible films

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