High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules. The equipment has been planning to have automatic GO/NO GO judgment technology by high-throughput measurement of current signal distribution with non-contact sensor arrays with small coils over the bonding wires of IGBT chips. Basic technology and Prototypes of a sensor, an analog amplifier, digital compensation technology, a test head and power circuit have been almost completed. The authors will fabricate the sensor arrays and develop GO/NO GO judgement technology with the integration of a basic technology.
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机译：为了防止功率模块过早失效，正在开发用于生产线的高通量DBC组装IGBT屏蔽设备。该设备已计划采用高通量测量电流信号分布的自动GO / NO GO判断技术，该技术采用非接触式传感器阵列和IGBT芯片键合线上带有小线圈的非接触式传感器阵列。传感器，模拟放大器，数字补偿技术，测试头和电源电路的基本技术和原型已基本完成。作者将制造传感器阵列，并结合基本技术开发GO / NO GO判断技术。
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