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首页> 外文会议>2014 8th International Conference on Integrated Power Systems >A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography
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A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

机译：使用X射线计算机断层扫描对Al丝键合热循环过程中裂纹发展的无损研究

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摘要

This paper concerns the non-destructive visualisation of the evolution of damage within ultrasonically bonded aluminium wires using three dimensional x-ray computed tomography. We demonstrate the potential to observe the progressive accumulation of damage within the same wires during passive thermal cycling between -55??C and 190??C. Tomography datasets were obtained prior to and after cycling. Cracks could be seen emerging from the extreme ends of the bonds when imaged after 105 cycles. Subsequent cycling lead to the advancement of these cracks toward the centres of the bonds. In addition, damage developed within the interior of the bonds; these also grew with increase in number of cycles, and merged with existing cracks. Virtual cross-sections have been analysed to quantify the rate of damage build up.
机译：本文涉及使用三维X射线计算机断层摄影技术对超声键合铝导线内的损伤演变进行无损可视化。我们证明了在-55℃至190℃之间的被动热循环过程中观察到相同导线内损伤累积的可能性。断层扫描数据集在循环之前和之后获得。在105个循环后成像时，可以看到从粘结的末端出现了裂纹。随后的循环导致这些裂纹向粘结中心发展。此外，在键内部产生的损坏；这些也随着循环次数的增加而增长，并与现有裂缝合并。已对虚拟横截面进行了分析，以量化损伤累积的速率。

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