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首页> 外文会议>2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, 16th International Conference on Electronic Materials and packaging >The Impact-emap 2014, 9th International conference on electronics, materials and packaging, and the 16th International symposium on electronic materials and packaging: Thesis for study analysis of memory packaging and testing industry
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The Impact-emap 2014, 9th International conference on electronics, materials and packaging, and the 16th International symposium on electronic materials and packaging: Thesis for study analysis of memory packaging and testing industry

机译：2014年Impact-emap，第9届电子，材料和包装国际会议以及第16届电子材料和包装国际研讨会：存储器包装和测试行业的研究分析论文

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Taiwanese memory packaging and testing factories include Powertech, ChipMOS, ASE, SPIL, Walton and FATC. The global three first tier giants, Samsung Electronics, Hynix and Micron, have predicted that the DRAM market in 2014 will be more stable. With the three-giant monopolization taking shape, the strategic alliance and corresponding excess profits of back-end packaging factories are expected to be gradually improved. The computex new products covering semiconductors/components, green energy efficiency, Fujitsu wafer manufacturing, packaging and testing, and memories, etc. are going to take to the stage and Taiwanese IC design related firms are scrambling to grab any business opportunities. All of these will be sensationally showcased at the Taipei International Computer Show. 3D NAND will be the future trend and price competition will be the challenge of respective factories. SK Hynix and Samsung will race to launch green semiconductors, with which the information center trade will turn out to be the biggest customer. NAND Flash will march into the corporate storage market and the conventional storage trade will face a greater challenge. Fujitsu is optimistic about the demand for 4G transistors in 2014, in which the demand will be much stronger in the second half. Samsung and STMicroelectronics will expand its contract manufacturing of 28nm FD-Soi. SPIL, a packaging and testing factory, will devote its efforts to becoming the world 2 largest packaging factory. As indicated by its president Lin Wen-Bo, as sustained by the popularity of smart phones, the demand for advanced semi-conductor packaging will continue to remain strong in 2014 which will lead to continuation of the profits. According to Korea, Times, the world number one technology giant Samsung has boasted its memory chip business, but the business has now been put to the tough test. For green energy efficiency and Taiwan's solar power integration, Morris Chang will be the key decision maker- Google will invest 600 million US dollars in the data center at Lenoir of North Carolina, and participate in foundry services. Apple's release of orders will offer more business opportunities, with which production of smart phones and components will expand.
机译：台湾的存储器封装和测试工厂包括Powertech，ChipMOS，ASE，SPIL，Walton和FATC。全球三大巨头三星电子，海力士和美光公司都预测，2014年的DRAM市场将更加稳定。随着三巨头垄断的形成，后端包装工厂的战略联盟和相应的超额利润有望逐步改善。涉及半导体/组件，绿色能源效率，富士通晶圆制造，封装和测试以及存储器等的computex新产品将登上舞台，而台湾IC设计相关公司则争先恐后地抓住任何商机。所有这些都会在台北国际计算机展上大放异彩。 3D NAND将是未来的趋势，价格竞争将是各个工厂的挑战。 SK海力士和三星将竞相推出绿色半导体，信息中心行业将成为最大的客户。 NAND Flash将进军企业存储市场，传统存储行业将面临更大的挑战。富士通对2014年对4G晶体管的需求感到乐观，其中下半年的需求将大大增加。三星和意法半导体将扩大其28nm FD-Soi的合同制造。 SPIL，一家包装和测试工厂，将致力于成为世界第二大包装工厂。正如其总裁林文波所言，随着智能手机的普及，对先进半导体封装的需求在2014年将继续保持强劲，这将导致利润的持续增长。根据《韩国时报》的报道，世界排名第一的科技巨头三星已经夸耀了其存储芯片业务，但该业务现在已经经受了严峻考验。在绿色能源效率和台湾太阳能整合方面，张瑞明将是关键决策者-谷歌将投资6亿美元在北卡罗莱纳州勒努瓦的数据中心，并参与铸造服务。苹果发布的订单将提供更多的商机，从而扩大智能手机和组件的生产。

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