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Millimeter-wave silicon-on-glass integrated technology

机译:毫米波玻璃硅集成技术

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摘要

A new Silicon-on-Glass (SOG) technology for millimeter-wave (mmW) /Terahertz (THz) integrated circuits is presented. The main characteristics and advantages of the proposed technology are discussed and compared with the state of the art. Novel mmW high-performance phase shifter and 3-dB in-phase power divider, implemented in the proposed low-loss and low-cost integrated technology platform, are presented. The total average loss of the divider is less than 0.4 dB over 150-220 GHz band. The phase shifter produces a large phase shift of 82° (measured) and an insertion loss variation of less than 0.8 dB at 110 GHz.
机译:提出了一种用于毫米波(mmW)/太赫兹(THz)集成电路的新的玻璃上硅(SOG)技术。讨论了所提出技术的主要特征和优点,并与现有技术进行了比较。介绍了在建议的低损耗,低成本集成技术平台中实现的新型mmW高性能移相器和3dB同相功率分配器。分频器的总平均损耗在150-220 GHz频带内小于0.4 dB。移相器在110 GHz时产生82°的大相移(测量值),插入损耗变化小于0.8 dB。

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