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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin cured with different curing agents
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Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin cured with different curing agents

机译：用不同固化剂固化的某些液晶环氧树脂的固化机理和热性能

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摘要

Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin (LCER), 4,4'-bis(4-hydroxybenzoyloxy)-3,3',5,5'-tetramethyl biphenyl (DGE-BHBTMBP) cured with three different curing agents 4,4'-diaminodiphenylsulphone (DDS), biphenyl diamine (BPDA), dihydroxybiphenyl (DOD) were investigated. Curing mechanism of DGE-BHBTMBP reacted with three different curing agents were investigated by non-isothermal differential scanning calorimetry (DSC). Thermal properties of different cured systems were evaluated by dynamical mechanical analysis (DMA) and thermo gravity analysis (TGA). The results indicated that DGE-BHBTMBP cured with DOD belongs to epoxy-hydroxy reaction scheme leading to low reaction activity and thus low cross-linking degree, which results in poor thermal properties. Cured systems DGE-BHBTMBP/DDS and DGE-BHBTMBP/BPDA belonged to epoxy-amine reaction scheme have excellent thermal properties due to the high cross-linking degree. Specially, DGE-BHBTMBP cured with DDS possesses high glass transition temperature (above 180 °C) and thermal decomposition temperature (above 370 °C). The obtained results are important for applications of DGE-BHBTMBP as polymer matrix in the application of electronic packaging materials.
机译：三种不同固化方式固化的某些液晶环氧树脂（LCER），4,4'-双（4-羟基苯甲酰氧基）-3,3'，5,5'-四甲基联苯（DGE-BHBTMBP）的固化机理和热性能研究了4,4'-二氨基二苯砜（DDS），联苯二胺（BPDA），二羟基联苯（DOD）的作用。通过非等温差示扫描量热法（DSC）研究了DGE-BHBTMBP与三种不同固化剂反应的固化机理。通过动态力学分析（DMA）和热重分析（TGA）评估了不同固化体系的热性能。结果表明，DOD固化的DGE-BHBTMBP属于环氧-羟基反应体系，反应活性低，交联度低，热性能差。属于环氧-胺反应方案的固化体系DGE-BHBTMBP / DDS和DGE-BHBTMBP / BPDA由于具有较高的交联度，因此具有优异的热性能。特别是，用DDS固化的DGE-BHBTMBP具有较高的玻璃化转变温度（高于180°C）和热分解温度（高于370°C）。获得的结果对于将DGE-BHBTMBP作为聚合物基质在电子包装材料中的应用具有重要意义。

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