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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >The effect of coating thickness and external force on the growth of tin whisker
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The effect of coating thickness and external force on the growth of tin whisker

机译：涂层厚度和外力对锡晶须生长的影响

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In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM). It is observed that the electroplating tin coating was capable of growing tin whiskers. Most of the detected whiskers are so called “nodule” type whiskers, approximately 10–15μm length with 3.28μm thickness. It was found that the thickness of coating has a major effect on causing tin whiskers of the electroplating tin coating. Another reason is large residual stress in the thin coating. In addition, it is found that pressure can induce the growth of tin whisker more easily than tension.
机译：本文研究了在不同环境下电镀锡涂层的晶须行为。测试了铜基板上不同厚度的电镀锡涂层。应用了两种不同的环境条件：一项温度测试（70°C）和一项外力测试（70°C /17.5N）。使用扫描电子显微镜（SEM）研究了锡晶须的生长。观察到电镀锡涂层能够生长锡晶须。大多数检测到的晶须称为“结节”型晶须，其长度约为10–15μm，厚度为3.28μm。已经发现，涂层的厚度对引起电镀锡涂层的锡晶须具有主要影响。另一个原因是薄涂层中的残余应力很大。另外，发现压力比张力更容易引起锡晶须的生长。

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