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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >Numerical simulation and analysis on thermal coupling effect of MCM packaging
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Numerical simulation and analysis on thermal coupling effect of MCM packaging

机译：MCM包装热耦合效应的数值模拟与分析

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摘要

System-in-package (SiP) has been adapted as one of the most promising packaging technologies with the development of mobile devices. It could greatly reduce the package size and enhance the device performance. As the electronic packaging technology progresses quickly, various SiPs have been designed and the structure of SiP is becoming more diversified. However, the relatively complex structure of SiP may cause unexpected failure during practical application. In this paper, a 3D package with one larger chip and four smaller chips on the front and back side of a FR4 board respectively was designed to study the reliability of SiP. The devices experienced a set of reliability tests including temperature cycling tests and drop tests under JEDEC standards. Furthermore, double-layer stacked samples were assembled and went through drop tests. Finally, failure analysis was carried out to find out the failure mechanism. Simplified MCM packaging models with different chip numbers and different chip distribution were built up. The paper uses numerical simulation method to study the thermal field and thermal stress distribution of package with different chip number, chip arrangement, heat convention coefficient and different substrate material. Multi-chip's heat resistance also been calculated, but was affected by thermal coupling much and led to the inaccurate results. By simulation result, heat convection coefficient is the most critical factor that affects packaging temperature; change the distribution mode can improve the packaging stability; among the different substrate materials, SiCp/Al is considered as a good packaging material in its proper mechanical and thermal property. From this paper, general heat and stress distribution and their main influence factor of MCM packaging will be obtained, along with their influence mechanism. This paper will have big significance on MCM packaging's optimization design and improvement of working stability.
机译：随着移动设备的发展，系统级封装（SiP）已成为最有前途的封装技术之一。它可以大大减小包装尺寸并提高设备性能。随着电子封装技术的飞速发展，已经设计了各种SiP，并且SiP的结构也越来越多样化。但是，SiP的相对复杂的结构在实际应用中可能会导致意外的故障。本文设计了一种3D封装，用于在FR4板的正面和背面分别具有一个较大的芯片和四个较小的芯片，以研究SiP的可靠性。这些设备经历了一系列可靠性测试，包括根据JEDEC标准进行的温度循环测试和跌落测试。此外，组装了双层堆叠的样品并通过了跌落测试。最后，进行故障分析，找出故障机理。建立了具有不同芯片编号和不同芯片分布的简化MCM封装模型。本文采用数值模拟的方法研究了芯片数量，芯片排列，热惯性系数和衬底材料不同的封装的热场和热应力分布。还计算了多芯片的耐热性，但受热耦合的影响很大，并导致结果不准确。根据仿真结果，热对流系数是影响包装温度的最关键因素。改变分配方式可以提高包装的稳定性；在不同的基材材料中，SiCp / Al具有适当的机械和热性能，被认为是一种良好的包装材料。从本文中，将获得MCM包装的一般热量和应力分布及其主要影响因素，以及它们的影响机理。本文对MCM包装的优化设计和提高工作稳定性具有重要意义。

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