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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >Effect of SiC whiskers addition on microstructure, microhardness and wettablility of Sn-Ag-Cu solder
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Effect of SiC whiskers addition on microstructure, microhardness and wettablility of Sn-Ag-Cu solder

机译：添加SiC晶须对Sn-Ag-Cu焊料的组织，显微硬度和可焊性的影响

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摘要

A novel SiC doped SAC305 composite solder was developed by mechanically mixing various amount of the SiC whiskers with Sn-3.0Ag-0.5Cu solder paste. The effect of SiC whiskers addition on microstructure, microhardness and wettability of the composite solders was investigated. It was found that the eutectic structure was refined in the composite solder, and both of the microhardness and wettability of the composite solders were improved. Specifically, 0.1 wt.% of SiC whiskers addition in composite solder lead to 29.2% increase in hardness while 0.2 wt.% of SiC whiskers addition cause a 6.3% decrease in the contact angle.
机译：通过将各种数量的SiC晶须与Sn-3.0Ag-0.5Cu焊膏机械混合，开发了一种新型的SiC掺杂SAC305复合焊料。研究了SiC晶须的添加对复合焊料的组织，显微硬度和润湿性的影响。发现复合焊料中的共晶结构得到改善，并且复合焊料的显微硬度和润湿性均得到改善。具体地，在复合焊料中添加0.1重量％的SiC晶须导致硬度增加29.2％，而添加0.2重量％的SiC晶须导致接触角降低6.3％。

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