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首页> 外文会议>22nd Annual Meeting of the Adhesion Society, Feb 21-24, 1999, Panama City Beach, Florida >THERMOELECTRIC MEASUREMENTS: A NEW TOOL FOR CHARACTERIZING BOND PADS
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THERMOELECTRIC MEASUREMENTS: A NEW TOOL FOR CHARACTERIZING BOND PADS

机译：热电测量：表征粘合垫的新工具

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摘要

The developed bondability analyzer based on thermoelectric temperature measurement of the bond ball is an accurate and simple method to determine the bond contact quality. Bond pads with high bond contact quality (limit 5 g pull force) have thermoelectric signals that are about 100% higher than those obtained for pads showing low bond strengths. The sensitivity and the accuracy of the bondability analyzer allow to study the ultrasonic wire bonding process in detail and in real time. Furthermore it is possible to check the bond quality of various materials without changing the set-up of the thermo-couple device. The authors are grateful to G. Mueller and Z. Stoessel from ESEC SA for helpful discussions. R. Schmid and E. Mooser provided skilful technical assistance. We gratefully acknowledge financial support by the Commission of Technology and Innovation (CTI) of Switzerland.
机译：基于键合球的热电温度测量而开发的键合性分析仪是确定键合接触质量的准确而简单的方法。具有高键接触质量（极限拉力为5 g）的键合垫具有比显示低键合强度的键合垫高100％的热电信号。结合能力分析仪的灵敏度和准确性使我们可以实时详细地研究超声波引线结合过程。此外，可以在不改变热电偶装置设置的情况下检查各种材料的粘结质量。作者感谢ESEC SA的G. Mueller和Z. Stoessel的有益讨论。 R. Schmid和E. Mooser提供了熟练的技术帮助。我们非常感谢瑞士技术与创新委员会（CTI）的财政支持。

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