ADHESION STUDIES AT DIE ATTACH EPOXY - COPPER LEADFRAME INTERFACES

机译：模具连接环氧树脂-铜铅框架界面的附着力研究

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The objective of this investigation is to deepen our understanding of the adhesive strength of silver-filled, epoxy-based adhesives bonded to typical lead frame surfaces such as copper. Such interfaces are common place in the microelectronics industry and can play an important role in the reliability of plastic encapsulated packages. The experimental approach consists of characterizing surfaces using advancing contact angles, determining the interfacial and bulk fracture toughness using linear elastic fracture mechanics, and elucidating fracture mechanisms using microscopy. The interplay between intrinsic and extrinsic crack-tip shielding mechanism on the observed adhesive strength is discussed.

机译：这项研究的目的是加深我们对粘结在典型引线框架表面（例如铜）上的填充银的环氧树脂基粘合剂的粘合强度的了解。这种接口在微电子工业中很常见，并且可以在塑料封装的可靠性中发挥重要作用。实验方法包括使用前进的接触角表征表面，使用线性弹性断裂力学确定界面和整体断裂韧度以及使用显微镜阐明断裂机理。讨论了内在和外在的裂纹尖端屏蔽机制对观察到的粘合强度之间的相互作用。

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来源
《22nd Annual Meeting of the Adhesion Society, Feb 21-24, 1999, Panama City Beach, Florida》|1999年|p.45-47|共3页
会议地点 Panama FL(US);Panama FL(US)
作者
Raymond A. Pearson;
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作者单位

Materials Research Center Microelectronics Packaging Materials Lab Lehigh University Bethlehem, PA 18015-3195;

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会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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专利

1. Ultrasonic characterization of the interface between a die attach adhesive and a copper leadframe in IC packaging [J] . N.Guo, J.Abdul, H.Du, Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2002,第9期

机译：IC封装中管芯粘胶和铜引线框架之间的界面的超声表征
2. Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers [J] . Mingzhi Ni, Ming Li, Dali Mao Microelectronics reliability . 2012,第1期

机译：使用成型镍层改善环氧树脂-钯预镀引线框界面的附着力
3. The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound [J] . Soon-Jin Cho, Kyung-Wook Paik IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1997,第2期

机译：铜基引线框的氧化对铜金属与环氧模塑化合物之间界面粘附力的影响
4. Adhesion studies at die attach epoxy-copper leadframe interfaces [C] . Raymond A. Pearson Annual Meeting of the Adhesion Society . 1999

机译：模具附着的粘附性研究环氧树脂 - 铜引线框架界面
5. Diffusion barriers/adhesion promoters. Surface and interfacial studies of copper and copper -aluminum alloys [D] . Shepherd, Krupanand Solomon. 2000

机译：扩散屏障/粘附促进剂。铜及铜铝合金的表面和界面研究
6. Sum Frequency Generation Studies on Bioadhesion: Elucidating the Molecular Structure of Proteins at Interfaces [O] . Stéphanie Le Clair, Khoi Nguyen, Zhan Chen -1

机译：生物粘度的频率生成研究：阐明界面蛋白质的分子结构
7. A study of highly crosslinked Epoxy Molding Compound and its interface with copper substrate by molecular dynamic simulations [O] . Shaorui Yang, Feng Gao, Jianmin Qu 2010

机译：分子动态模拟对高度交联的环氧模塑化合物及其与铜基材界面的研究
8. A review of surface segregation, adhesion and friction studies performed on copper-aluminum, copper-tin and iron-aluminum alloys [R] . Buckley, D. H., Ferrante, J. 1971

机译：回顾了对铜铝，铜锡和铁铝合金进行的表面偏析，粘附和摩擦研究

ADHESION STUDIES AT DIE ATTACH EPOXY - COPPER LEADFRAME INTERFACES

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