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首页> 外文会议>22nd Annual Meeting of the Adhesion Society, Feb 21-24, 1999, Panama City Beach, Florida >Epoxy-Episulfide Resins for Electronic Applications
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Epoxy-Episulfide Resins for Electronic Applications

机译：电子应用的环氧表硫化树脂

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摘要

In previous studies, an epoxy-episulfide-polyamide system (Figure 1) has been developed for implants and adhesives in the human body that has significant advantages over standard epoxy resins: the gel time and water absorption arelower. Moreover, theheat ofreaction of this system is low, resulting in low cure shrinkage. The glass transition temperature (Tg) and the tensile strength of this system are higher than those of standard epoxies. Near Infrared Spectroscopy reveals that these good properties result from the formation of two network structures: a conventional epoxy/amine structure and an episulfide homopolymer structure[l, 2]. In addition to the improved properties of the resin itself, the episulfide group is expected to react with many kinds of metals due to the fact that thiol groups (-SH) easily react with metal surfaces, such as gold, silver, copper, and iron, to form sulfur-metal bonds. Therefore, the epoxy-episulfide resin system is expected to improve not only the resin properties, but also corrosion resistance and adhesion properties in composite materials, such as are found in printed circuit boards and other metal/epoxy bonded products.
机译：在以前的研究中，已经开发出一种环氧-环硫化物-聚酰胺系统（图1）用于人体中的植入物和粘合剂，它比标准环氧树脂具有明显的优势：凝胶时间和吸水率更低。而且，该体系的反应热低，导致固化收缩率低。该体系的玻璃化转变温度（Tg）和抗张强度高于标准环氧树脂。近红外光谱表明，这些良好的性能是由两个网状结构形成的：常规的环氧/胺结构和环硫化物均聚物结构[1、2]。除了改善树脂本身的性能外，由于硫醇基（-SH）容易与金属表面（如金，银，铜和铁）反应，因此预计环硫基会与多种金属反应，形成硫金属键。因此，期望环氧-环氧二硫化物树脂体系不仅改善树脂性能，而且还改善复合材料中的耐腐蚀性和粘附性，例如在印刷电路板和其他金属/环氧结合产品中所发现的。

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