• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>22nd Annual Meeting of the Adhesion Society, Feb 21-24, 1999, Panama City Beach, Florida >MODELING AND PREDICTING FAILURE OF ADHESIVE JOINTS
【24h】

MODELING AND PREDICTING FAILURE OF ADHESIVE JOINTS

机译：胶粘接头的建模和预测失败

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Adhesive joints have been widely used in many engineering areas. The failure of an adhesive joint is usually accompanied by the growth of a crack along the bond-line. More importantly, in many applications the adherends of a joint may experience extensive plastic deformation before the fracture occurs. This results in the fact that the fracture energy is coupled with the macroscopic plasticity in adherends, and analytical solutions based on beam theory are not adequate to predict the failure of adhesive joints (Yang et al. 1998, Wei & Hutchinson 1997). It is crucial to develop new approaches to address such problems. In this paper, a numerical approach is being developed to predict the failure of adhesive joints in the presence of large scale plasticity, such as that observed in peel and shear-lap tests. This approach is based on the embedded-process-zone (EPZ) model in which the failure process of the adhesive layer (or interface) is characterized mainly by parameters representing both the fracture energy (Γ_o) and the peak stresses (σ) supported by the interface (Yang et al. 1998). This type of model permits crack growth to be coupled directly to the deformation of the adherends and the applied load. Provided the constitutive properties of the adherends are determined independently, the crack growth parameters can be obtained by comparing the fracture behavior observed in an experimental test to numerical simulations. These crack-growth parameters are then taken to characterize the failure of a particular adhesive at a given strain rate, and can be subsequently used to predict failure of different geometries of joints. The approach that has been developed allows, for the first time, quantitative and accurate predictions for the applied loads, displacements and deformed shapes associated with the failure of adhesive joints. In this paper, this approach will be used to simulate the failure of two different type of adhesive joints-symmetrical 90° peel joint and single-shear-lap joint. The failure of the 90° peel joint is pure mode-I fracture and that of the shear-lap joint is a mixed-mode fracture. Associated experimental results are used to verify the numerical predictions.
机译：胶粘接头已广泛应用于许多工程领域。粘合接头的失效通常伴随着沿粘合线的裂纹的增长。更重要的是，在许多应用中，接头的被粘物在断裂发生之前可能会经历广泛的塑性变形。这导致了断裂能与被粘物的宏观可塑性相关联的事实，基于梁理论的分析解决方案不足以预测粘合接头的破坏（Yang等，1998； Wei＆Hutchinson，1997）。开发解决此类问题的新方法至关重要。在本文中，正在开发一种数值方法来预测在存在大规模可塑性的情况下粘合接头的失效，例如在剥离和剪切试验中观察到的。此方法基于嵌入式过程区域（EPZ）模型，其中粘合剂层（或界面）的破坏过程主要由代表断裂能（Γ_o）和峰值应力（σ）的参数来表征。接口（Yang等，1998）。这种类型的模型允许裂纹扩展直接与被粘物的变形和施加的载荷耦合。如果独立确定被粘物的本构特性，则可以通过将实验测试中观察到的断裂行为与数值模拟进行比较来获得裂纹扩展参数。然后，采用这些裂纹增长参数来表征特定粘合剂在给定应变率下的失效，并随后可用于预测接头不同几何形状的失效。已经开发出的方法首次允许对与胶粘接头失效相关的施加载荷，位移和变形形状进行定量和准确的预测。在本文中，该方法将用于模拟两种不同类型的粘合接头（对称的90°剥离接头和单剪切搭接接头）的失效。 90°剥离接头的断裂是纯I型断裂，而剪切搭接接头的断裂是混合型断裂。相关的实验结果用于验证数值预测。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号