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首页> 外文会议>22nd Annual Meeting of the Adhesion Society, Feb 21-24, 1999, Panama City Beach, Florida >Dielectric Relaxation of Novel Polyimides
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Dielectric Relaxation of Novel Polyimides

机译：新型聚酰亚胺的介电弛豫

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摘要

Polyimides are a broad class of polymeric material used extensively in the electronics industry, particularly in thin film applications. High degradation temperature, solvent resistance, and a low dielectric constant are some of the important properties that make polyimides successful. Examples of thin film applications include resists, dielectric layers in metal-polymer multi-layered structure for on-chip interconnects, and as a flexible replacement to conventional circuit boards. Dissipative mechanisms responsible for the adhesive performance of polyimides depend on time-dependent processes on the molecular level. One of the most effective means of probing processes at the molecular level is by dielectric analysis. Using frequency ranges much greater than that of mechanical testing, dielectric analysis affords exploration of molecular movements that occur at even shorter and shorter time scales. The goals of this research are too characterize the molecular relaxations of three novel polyimides using dielectric analysis. The dielectric spectrum of each material, activation energies, and complex permittivity plots and Havriliak-Negami constants will be presented for each material.
机译：聚酰亚胺是一类广泛的聚合物材料，广泛用于电子工业，尤其是薄膜应用中。高降解温度，耐溶剂性和低介电常数是使聚酰亚胺成功的一些重要特性。薄膜应用的示例包括抗蚀剂，用于芯片上互连的金属聚合物多层结构中的介电层，以及作为常规电路板的灵活替代品。造成聚酰亚胺粘合性能的耗散机制取决于分子水平上随时间变化的过程。在分子水平上探测过程最有效的方法之一是通过介电分析。使用比机械测试大得多的频率范围，介电分析可以探索在越来越短的时间范围内发生的分子运动。这项研究的目的也是通过介电分析表征三种新型聚酰亚胺的分子弛豫。每种材料的介电谱，活化能，复介电常数图和Havriliak-Negami常数都将显示出来。

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