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首页> 外文会议>26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington >High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities
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High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities

机译：镀镍杂质引起的高温焊料（Au / Sn）故障

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摘要

High temperature gold/tin eutectic (80 Au/ 20 Sn) solder is used in manufacturing for multiple reasons. These motives may include the ability to post solder a part/device without reflow, high temperature field applications, and allow soldering to thick Au layers without the possibility of precipitating AuSn_4 brittle intermetallics. In the following military case, Au/Sn eutectic was employed because of high temperature service and the guarantee of no occurrence of gold embrittlement when soldering to the thick Au outer plating. The Au was plated over an electroplated nickel (Ni) layer on a Kovar (ironickel/cobalt) housing. The soldering resulted in an extremely poor bond strength of a duroid circuit to the Kovar housing. The results showed contamination in the supplier's electroplated Ni bath caused the plating to have poor bond strength. The failure occurred within the Ni plating layer.
机译：出于多种原因，高温金/锡共晶（80 Au / 20 Sn）焊料被用于制造。这些动机可能包括在不回流的情况下后焊零件/器件的能力，高温场的应用，并允许焊接到较厚的Au层而不会析出AuSn_4脆性金属间化合物。在下面的军事案例中，由于使用了高温的Au / Sn共晶，并且保证了在焊接到厚的Au外板上时不会发生金脆化。将金镀在可伐（铁/镍/钴）外壳的电镀镍（Ni）层上。焊接导致双曲面电路与Kovar外壳的结合强度极差。结果表明，供应商电镀镍浴中的污染导致镀层的结合强度差。失败发生在镀镍层内。

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