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首页> 外文会议>26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington >Automatic IC Die Positioning in the SEM
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Automatic IC Die Positioning in the SEM

机译：SEM中自动IC芯片定位

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摘要

This paper presents a new automatic die positioning system for failure analysis work in the scanning electron microscope (SEM). The system makes use of machine vision to automatically locate a pre-specified failure site on an integrated circuit (IC) sample, without the need for a high-accuracy specimen stage or modifications to existing SEM hardware. Depending on the appearance of the desired failure site, either image registration or feature tracking is used to locate the site. To locate failure sites containing unique and distinguishing features, such as those found on logic ICs, an image registration procedure is used. Experiments carried out on a microprocessor and an analogue-to-digital converter show that the new system is able to accurately locate the failure site, even in the presence of IC sample rotation and image scaling. Moreover, the accuracy of the technique has been shown to be independent of the complexity and minimum feature size of the sample used. To locate failure sites containing repetitive IC patterns, such as those from DRAM samples, a feature tracking approach was incorporated into the original die positioning algorithm. The final system can therefore locate many types of failure sites, regardless of whether they have unique features or repetitive IC patterns.
机译：本文提出了一种新的自动模具定位系统，用于在扫描电子显微镜（SEM）中进行故障分析。该系统利用机器视觉自动定位集成电路（IC）样品上的预定故障部位，而无需高精度样品台或修改现有SEM硬件。根据所需故障站点的外观，可以使用图像配准或功能跟踪来定位该站点。为了定位包含独特且与众不同的特征（例如在逻辑IC上发现的特征）的故障部位，使用了图像配准程序。在微处理器和模数转换器上进行的实验表明，即使存在IC样品旋转和图像缩放的情况，新系统也能够准确定位故障部位。此外，已证明该技术的准确性与所用样品的复杂性和最小特征尺寸无关。为了定位包含重复IC模式（例如来自DRAM样本的IC模式）的故障部位，特征跟踪方法已合并到原始管芯定位算法中。因此，最终系统可以定位许多类型的故障站点，而不管它们是否具有独特的功能或重复的IC模式。

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