X-Ray Tomography for Electronic Packages

机译：电子封装的X射线断层扫描

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Next generation assembly/package development challenges are primarily increased interconnect complexity and density with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools/techniques to support this technical roadmap. The key challenge in the analytical tools/techniques is the development of non-destructive imaging for improved time to information. This paper will present the key drivers for the non-destructive imaging, results of literature search and evaluation of key analytical techniques currently available. Based on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized.

机译：下一代组装/封装开发的挑战主要是互连复杂性和密度的提高以及开发时间的缩短。这种趋势的结果对支持该技术路线图的分析工具/技术提出了一些独特的挑战。分析工具/技术中的主要挑战是开发无损成像技术，以缩短信息获取时间。本文将介绍无损成像的主要驱动因素，文献检索的结果以及当前可用的关键分析技术的评估。基于这些研究，将讨论3D成像功能的要求。还总结了开发这种能力所需的关键突破。

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来源
《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》|2000年|p.49-54|共6页
会议地点 Bellevue Washington
作者
Deepak Goyal;
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作者单位

Intel Corporation, Chandler, AZ, USA;

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会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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X-Ray Tomography for Electronic Packages

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