Fabrication of capacitive ultrasonic transducers by a low-temperature and fully surface-micromachined process

机译：通过低温全表面微加工工艺制造电容式超声换能器

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摘要

The fabrication of capacitive ultrasonic transducers by means of surface micromachining techniques and low temperature process is reported. Transducers with resonance frequencies ranging from 4 to 6 MHz have been realized.

机译：报道了通过表面微加工技术和低温工艺制造电容式超声换能器。已经实现了谐振频率范围为4到6 MHz的传感器。

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来源
《2nd International EUSPEN Conference on Precision Engineering Nanotechnology Vol.1, May 27th-31st, 2001, Turin, Italy》|2001年|p.46-48|共3页
会议地点 Turin(IT)
作者
V. Foglietti; E. Cianci; D. Memmi; G. Caliano; M. Pappalardo;
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作者单位

CNR-IESS, Roma, Italy;

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原文格式 PDF
正文语种 eng
中图分类机械、仪表工业;
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专利

1. Fabrication of capacitive ultrasonic transducers by a low temperature and fully surface-micromachined process [J] . E. Cianci, V. Foglietti, D. Memmi, Precision Engineering . 2002,第4期

机译：通过低温和全表面微加工工艺制造电容式超声换能器
2. Fabrication of capacitive micromechanical ultrasonic transducers by low-temperature process [J] . Memmi D., Foglietti V., Cianci E., Sensors and Actuators, A. Physical . 2002,第1a2期

机译：低温工艺制造电容式微机械超声换能器
3. Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology [J] . Libo Zhao, Jie Li, Zhikang Li, Sensors and Actuators, A. Physical . 2017,第期

机译：具有低温直接晶圆粘合技术的电容式微机械超声换能器的制造
4. Fabrication of capacitive ultrasonic transducers by a low-temperature and fully surface-micromachined process [C] . euspen European society for precision engineering and nanotechnology International Conference, european society for precision engineering and nanotechnology . 2001

机译：通过低温和全表面微机械加工制造电容式超声换能器
5. THE DESIGN AND FABRICATION OF ULTRASONIC TRANSDUCERS AND TRANSDUCER ARRAYS [D] . SELFRIDGE, ALAN ROBERT. 1983

机译：超声波传感器和传感器阵列的设计与制造
6. Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding [O] . Xiaoqing Wang, Yude Yu, Jin Ning 2016

机译：低温晶片直接键合的电容式微机械超声换能器的制备与表征
7. Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding [O] . Xiaoqing Wang, Yude Yu, Jin Ning 2016

机译：具有低温晶圆直接键合的电容式微机械超声换能器的制作与表征
8. Capacitive Ultrasonic Transducers and Imaging Systems [R] . Mattila, P. 1996

机译：电容式超声波换能器和成像系统

Fabrication of capacitive ultrasonic transducers by a low-temperature and fully surface-micromachined process

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