The Future of High Performance Copper Alloys in Computer and Telecommunication Applications

机译：高性能铜合金在计算机和电信应用中的未来

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Interconnect reliability over the life of the device is critical to the OEM's survival in the market place. Electronic communication and data transfer requirements continue to drive the need for faster and more reliable connectors and contacts. Miniaturization, harsh operating environments, mechanical shock, fatigue durability, and high operating frequency requirements continue to tighten. This paper investigates the changes in technology that are driving the needs for high performance alloys in interconnect applications and predicts future alloy performance requirements.

机译：设备使用寿命内的互连可靠性对于OEM在市场上的生存至关重要。电子通信和数据传输的要求继续推动了对更快，更可靠的连接器和触点的需求。小型化，苛刻的操作环境，机械冲击，疲劳耐久性以及高工作频率要求不断提高。本文研究了推动互连应用中高性能合金需求的技术变化，并预测了未来的合金性能要求。

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来源
《35th Annual IICIT Connector and Interconnection Technology Symposium and Trade Show; Oct 7-9, 2002; Orlando, Florida》|2002年|p.125-133|共9页
会议地点 Orlando FL(US);Orlando FL(US)
作者
Jim Johnson;
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Brush Wellman Inc.;

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原文格式 PDF
正文语种 eng
中图分类电工技术;
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The Future of High Performance Copper Alloys in Computer and Telecommunication Applications

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