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首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >Adhesive Flip Chip Joining on FR-4 substrates
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Adhesive Flip Chip Joining on FR-4 substrates

机译：FR-4基板上的倒装芯片粘合

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Anisotropic conductive adhesive films (ACF) were used to attach daisy chained test chips on FR-4 substrates. Feasibility of ACF joining has been studied since it is a potential method for fine pitch bare die attachment on low cost organic substrate. Four types of test chips were used each having pitch of different size. One of the chips had area array structure while the others had peripheral structure. The reliability of the flip chip joints was evaluated by subjecting the test chips to temperature cycling test and preceding conventional reflow process. Temperature cycling test was performed in two periods. The first test period was carried out between temperatures -30deg C and +85deg C, while the second test period was from -40deg C to +125deg C. The joints were studied by electrical measurements and scanning electron microscope. The alignment of the chips was confirmed with a x-ray microscope. Low contact resistance value in the assemblies was obtained in the flip chip joining process. However, for one chip type open circuits were found although all the chips were alighned accurately. It is evident that coplanarity of substrate and chip plays important role on bonding quality of adhesive flip chip joints. In reflow process and reliability tests some of the tested samples seemed to fail due to stresses caused in bonding process. The other of the two tested adhesives showed decrease in contact resistance in the beginning of the testing, which is due to under cured adhesive.
机译：各向异性导电胶膜（ACF）用于将菊花链测试芯片附着在FR-4基板上。由于ACF连接是在低成本有机基板上进行细间距裸芯片连接的潜在方法，因此已经研究了ACF连接的可行性。使用四种类型的测试芯片，每个测试芯片具有不同尺寸的间距。其中一个芯片具有区域阵列结构，而其他芯片则具有外围结构。倒装芯片接头的可靠性通过对测试芯片进行温度循环测试和先前的常规回流工艺进行评估。分两个周期进行温度循环测试。第一个测试阶段在温度-30°C至+ 85°C之间进行，而第二个测试阶段是在-40°C至+ 125°C之间。通过电学测量和扫描电子显微镜对接头进行了研究。用X射线显微镜确认芯片的排列。通过倒装芯片接合工艺获得了组件中的低接触电阻值。然而，对于一种芯片类型，尽管所有芯片都被精确地保留，但发现开路。显然，基板和芯片的共面性对粘合剂倒装芯片接头的粘合质量起着重要作用。在回流过程和可靠性测试中，某些测试样品似乎由于粘合过程中产生的应力而失败。两种测试粘合剂中的另一种在测试开始时显示出接触电阻降低，这是由于粘合剂固化不足所致。

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