• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >Analysis of Optimal Structure by Finite Element Method for CSP/FCA Mounting on Build-up Board
【24h】

Analysis of Optimal Structure by Finite Element Method for CSP/FCA Mounting on Build-up Board

机译：CSP / FCA安装在积层板上的有限元分析的最佳结构

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

CSP (Chip Scale Package) and/or FCA (Flip Chip Attach) are becoming the important new high-density packaging technology for the consumer electric products. In addition, the use of build-up boards for mounting the packages has been tried. However, the reliability of the solder connection depends on the structure of the package, the motherboard, and the material properties. In this paper, the solder connection reliability for CSP and FCA packages, mounted on the build-up board, is assessed. The results based on optimizing each of the parameters are reported. The most reliable packaging design and a compact FEM (Finite Element Method) model for the reliability assessment are suggested. The verification of the numerical analysis results using tests on the actual hardware is also shown. On these results, this FEM model is applied into the reliability assessment of MCM with the evaluation of the warpage and Encapsulant volume.
机译：CSP（芯片级封装）和/或FCA（倒装芯片连接）正在成为消费电子产品重要的新高密度封装技术。另外，已经尝试使用组装板来安装包装。但是，焊接连接的可靠性取决于封装的结构，母板和材料特性。本文评估了安装在组装板上的CSP和FCA封装的焊接连接可靠性。报告了基于优化每个参数的结果。建议使用最可靠的包装设计和紧凑的FEM（有限元方法）模型进行可靠性评估。还显示了使用实际硬件上的测试对数值分析结果的验证。根据这些结果，将该有限元模型应用于翘曲度和密封剂体积的评估的MCM可靠性评估中。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号