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首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >Popcorn Testing of Liquid Encapsulants
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Popcorn Testing of Liquid Encapsulants

机译：液体密封剂的爆米花测试

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摘要

Glob-top encapsulation has found wide-spread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. This paper outlines the results of pop-corn tests on a wide range of liquid encapsulant materials. The materials were chosen on the basis of being market leaders in providing reliable protection for direct attached IC's and are used in several applications such as glob-top for COB through to IC protection in BGA and multi-chip style packaging. Evaluations based on variables such as encapsulant type, substrate material and wire-bond material were performed to compare these encapsulants. Electrical characterisation and non-destructive scanning acoustic microscopy were the main analysis techniques used on the samples.
机译：在低端消费产品的电子组装中，球形顶部封装已被广泛接受。为了将此封装方法的使用扩展到高可靠性和恶劣的环境条件，需要对可用材料进行严格评估。本文概述了在多种液体密封材料上进行爆米花测试的结果。选择这些材料的依据是在为直接连接的IC提供可靠保护方面处于市场领先地位，并且被用于多种应用，例如用于COB的球形顶部，用于BGA的IC保护以及多芯片样式封装。进行基于变量的评估，例如密封剂类型，基板材料和引线键合材料，以比较这些密封剂。电学表征和无损扫描声学显微镜是用于样品的主要分析技术。

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