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首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >Microwave and Millimeterwave Technology for Digital Radios and Communications - Technology Strategy and Packaging Roadmaps
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Microwave and Millimeterwave Technology for Digital Radios and Communications - Technology Strategy and Packaging Roadmaps

机译：用于数字无线电和通信的微波和毫米波技术-技术战略和包装路线图

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摘要

The continual growing demand for Millimeterwave Modules in Digital Radio applications like LMDS (Local Multipoint Distribution System) or LMCS (Local Multipoint Communication System) or MVDS (Microwave Video Distribution System) and related technologies are main part of the business mission in our Competence Center 'Micro- and Millimeterwave Technologies' of DaimlerChrysler Aerospace (Dasa). Based on a long term experience and history of modern active phased array radars and different applications (ground based, naval and airborne) the communication module market is still a big challenge for high volume processing in our Microwave Factory. Advanced substrate technologies, based on FR4 multilayers combined with teflon materials and the use of single packaged RF-MMICs with BGA (Ball Grid Array) will be compared with traditional module architectures based on the use of thin film ceramics and Chip&Wire technologies. Results and experience of a 38 GHz radio module with a MCM-C (Multichip Module, based on ceramics) in LTCC (Low Temperature Cofired Ceramic) technology will be discussed. Our technology strategy and packaging roadmap is mainly driven by long-term reliability, availability of basic materials and components and modularity. The trends of new module architectures and packaging technologies with GaAs chips in 'Hot-Via' technology will be shown.
机译：诸如LMDS（本地多点分发系统）或LMCS（本地多点通信系统）或MVDS（微波视频分发系统）等数字无线电应用对毫米波模块的需求不断增长，这是我们能力中心业务使命的主要部分。戴姆勒克莱斯勒航空航天公司（Dasa）的微毫米波技术公司。基于现代有源相控阵雷达的长期经验和历史以及不同的应用（地面，海军和机载），通信模块市场仍然是我们微波工厂进行大批量处理的一大挑战。基于FR4多层材料与特氟龙材料相结合的先进基板技术，以及采用BGA（球栅阵列）的单封装RF-MMIC的使用，将与基于薄膜陶瓷和Chip＆Wire技术的传统模块架构进行比较。将讨论采用LTCC（低温共烧陶瓷）技术的带有MCM-C（基于陶瓷的多芯片模块）的38 GHz无线电模块的结果和经验。我们的技术战略和包装路线图主要受长期可靠性，基本材料和组件的可用性以及模块化的推动。将展示采用“ Hot-Via”技术的GaAs芯片的新模块架构和封装技术的趋势。

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