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ANALYZING MECHANICAL STRESSES CAUSED BYTEMPERATURE GRADIENTS USING FINITE ELEMENTSSIMULATION

机译:用有限元模拟分析温度梯度引起的机械应力

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Temperature gradients in components and devices cause mechanical strain andrnstress. They are a main reason for failure or even breakdown of the components,rnespecially if these loads occur periodically.rnThe paper reports results of numerical simulations of temperature distributions insidernthe devices and the distribution of strain and stress in the different parts, materials andrnmaterial combinations caused by temperature distribution and material parameters.rnThe boundary conditions and heat flows are taken from separate studies about thernirradiation of surfaces with different optical properties. With the help of thesernsimulations, one can also identify regions with the highest possibility for a failure tornoccur, and optimize the design according to the requirements. Besides a possiblernchange in geometry, the simulations help to check combinations of different materialsrnand select materials with suitable properties.rnThe described way to analyze components and devices can be implemented in a veryrnearly state of development. Thus, this approach is much faster and cheaper thanrnexperimental testing and can therefore help industries to reduce development time andrncosts.
机译:组件和设备中的温度梯度会导致机械应变和应力。它们是导致组件失效甚至损坏的主要原因,特别是在这些负载周期性发生的情况下。rn本文报道了设备内部温度分布的数值模拟结果,以及由零件引起的不同零件,材料和材料组合中的应变和应力分布的结果。温度分布和材料参数。边界条件和热流来自对具有不同光学特性的表面进行辐照的单独研究。借助模拟,还可以确定发生故障的可能性最高的区域,并根据要求优化设计。除了可以改变几何形状外,这些模拟还有助于检查不同材料的组合并选择具有适当特性的材料。所描述的分析组件和设备的方法可以在非常近的发展状态下实现。因此,这种方法比实验测试更快,更便宜,因此可以帮助行业减少开发时间和成本。

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