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首页> 外文会议>4th International Conference on Nanochannels, Microchannels and Minichannels 2006(ICNMM2006) pt.B >SIMULATION AND ANALYSIS OF METAL MICROFLUIDIC HEATSINKS
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SIMULATION AND ANALYSIS OF METAL MICROFLUIDIC HEATSINKS

机译：金属微流传热模拟与分析

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摘要

Microfluidic heatsinks are usually fabricated in silicon substrates using micromachining methods. Fabrication of microfluidic heatsinks in metals is captivating due to the potential of higher heat conductance of many metals compared to silicon. In this work, metallic microfluidic structures fabricated of copper, silicon, and nickel are simulated and analyzed using the FEM method. The parametric dependence of the overall thermal resistance on the heatsink material, fluid velocity, and channel geometry is examined. Their performance is compared based on the shape and size of the microchannels, their separating distance from each other, and the flow rate. Simulations were done using FEMLAB v.3.2 (Comsol Multyphysics). The length of the microchannels considered is 1cm. Their cross section is rectangular. Simulated heatsinks are covered with 50 μm of the same material as the body and the total area of the heat sink is 1cm x 1cm. Water is used as the coolant with an input temperature of 300 K. These simulations show that most of the thermal resistance in the heatsink occurs in the fluid region. For the constant and uniform input heating power of 100 W/cm~2 the performance of the structure is studied, at steady state with the fluid velocity varied from 1 to 14m/s. Finally, experimental fabrication of an electroplated copper micro-channel system with rectangular channels is shown.
机译：通常使用微加工方法在硅衬底中制造微流体散热器。由于与硅相比，许多金属具有更高的导热性，因此金属中微流体散热器的制造令人着迷。在这项工作中，使用FEM方法模拟和分析了由铜，硅和镍制成的金属微流体结构。检查了总热阻对散热片材料，流体速度和通道几何形状的参数依赖性。根据微通道的形状和大小，它们彼此之间的分隔距离以及流速来比较它们的性能。使用FEMLAB v.3.2（Comsol Multyphysics）进行仿真。所考虑的微通道的长度为1cm。它们的横截面是矩形的。模拟的散热器覆盖有50μm与主体相同的材料，散热器的总面积为1cm x 1cm。水被用作输入温度为300 K的冷却剂。这些模拟表明，散热器中的大部分热阻都发生在流体区域。对于恒定且均匀的100 W / cm〜2的输入加热功率，研究了在稳态下流体速度从1到14m / s变化的结构的性能。最后，显示了具有矩形通道的电镀铜微通道系统的实验制造。

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