首页> 外文会议>63rd World Foundry Congress Sep 12-18, 1998 Budapest, Hungary >THE ADHESIVE HARDENING MECHANISM AND HYGROSCOPICITY-RESISTANT OF A-STARCH COMPOUND BINDER FOR DRY SAND MOLD (CORE)
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THE ADHESIVE HARDENING MECHANISM AND HYGROSCOPICITY-RESISTANT OF A-STARCH COMPOUND BINDER FOR DRY SAND MOLD (CORE)

机译:干砂模(核心)A淀粉复合粘合剂的粘结硬化机理和耐吸湿性

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摘要

The adhesive hardening mechanism and hygroscopicity-resistant of a-starch compound binder for dry sand mold (core) were studied by way of DSC, XRD, IR spectra analyses and SEM. It is thought that the bonding strength of molding sand is mainly depended on the strength of the adhesive membrane itself. While the binder is heated at certain temperature between 160℃ -200℃ for one hour, the reactions of condensation and condensation polymerization as well as esterification happen between silicon-hydroxyl groups (-SiOH) of sodium silicate, starch and sodium silicate, starch and phosphate respectively, thus, a three-dimensional skeleton mainly consisting of Si (silicon), O (oxygen) C (carbon), P (phosphorus) is formed. And kaolin grains adsorbing a layer of starch gum are well-distributed in the skeleton, therefore the binder is provided with higher low-temperature drying strength and better hygroscopicity-resistant. Because kaolin in the binder can react with sodium silicate and phosphate at high temperature separately, forming Al-O-Si three-dimensional skeleton and AIPO_4 correspondingly, the binder is also provided with higher high temperature-resistant strength.
机译:通过DSC,XRD,IR光谱分析和SEM等方法研究了干砂型(芯)a-淀粉复合胶粘剂的硬化机理和耐吸湿性。可以认为型砂的粘结强度主要取决于粘合膜本身的强度。当粘合剂在160℃-200℃之间的一定温度下加热一小时时,硅酸钠,淀粉和硅酸钠,淀粉和硅酸钠之间的缩合,缩聚以及酯化反应会发生。因此,形成了主要由Si(硅),O(氧),C(碳),P(磷)组成的三维骨架。并且,吸附有一层淀粉胶的高岭土颗粒在骨架中分布均匀,因此该粘合剂具有更高的低温干燥强度和更好的耐吸湿性。由于粘合剂中的高岭土可以分别与硅酸钠和磷酸盐在高温下反应,从而分别形成Al-O-Si三维骨架和AIPO_4,因此该粘合剂还具有较高的耐高温强度。

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