Graduate School of Mechanical Engineering,Hanyang University,17,Haengdang-dong,Seongdong-gu,Seoul,South Korea;
Mold Die Technology Center,Maufacturing Tech.Center,Samsung Electronics,416 Maetan 3-Dong,Yeongtong-gu,Suwon-si,Gyunggi-do,Korea;
Mold Die Technology Center,Maufacturing Tech.Center,Samsung Electronics,416 Maetan 3-Dong,Yeongtong-gu,Suwon-si,Gyunggi-do,Korea;
PIDOTECH,Engineering Center A209,Hanyang Univ.,222Wangsimni-ro,Seongdong-gu,Seoul,Korea;
Dept.of Mechanical Engineering,Hanyang University,17,Haengdang-dong,Seongdong-gu,Seoul,South Korea;
Bead Optimization; Springback Analysis; LCD Bottom Chassis;
机译:减少用桩珠的后伸出的回弹
机译:优化冲压工艺参数以预测和减少回弹和破坏准则
机译:优化冲压工艺参数以预测和减少回弹和破坏准则
机译:珠子优化减少液晶底底盘的回弹
机译:集中式底盘加工设施运输网络底盘运动的分析与优化
机译:底盘优化是基于合成生物学的策略在微生物次级代谢中应用的基石
机译:用于抑制阶梯式梁模型的皱纹和扭转回弹的最佳绘制珠子设置