EFFECT OF COPPER OXIDE ADDITIONS ON THE GRAIN BOUNDARY RESISTIVITY IN YTTRIA-TETRAGONAL ZIRCONIA

机译：氧化铜对氧化锆-四角形锆石晶界电阻率的影响

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The effects of CuO additions on the grain interior and grain boundary resistivity in coated 2.5 mol% Y-TZP ceramics have been studied by using impedance spectroscopy. The results showed that the grain interior and grain boundary resistivities increased with increasing CuO content. In particular, the grain boundary resistivity was observed to increase significantly in the doped ceramics, which could have been due to the formation of a Cu-rich grain boundary phase.

机译：通过使用阻抗谱研究了CuO添加对涂覆的2.5 mol％Y-TZP陶瓷的晶粒内部和晶界电阻率的影响。结果表明，随着CuO含量的增加，晶粒内部和晶界电阻率增加。特别地，观察到掺杂陶瓷中的晶界电阻率显着增加，这可能是由于形成了富铜的晶界相。

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来源
《8th Asian Conference on Solid State Ionics: Trends in the New Millennium; Dec 15-19, 2002; Langkawi, Malaysia》|2002年|p.583-590|共8页
会议地点 Langkaw(MY)
作者
S. RAMESH;
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作者单位

Department of Mechanical Engineering University Tenaga Nasional Km-7 Jalan Kajang-Puchong 43009 Kajang Selangor, Malaysia;

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原文格式 PDF
正文语种 eng
中图分类物理学;
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EFFECT OF COPPER OXIDE ADDITIONS ON THE GRAIN BOUNDARY RESISTIVITY IN YTTRIA-TETRAGONAL ZIRCONIA

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