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首页> 外文会议>8th International conference on commercialization of micro and nano systems (COMS 2003) >COST SAVINGS WITH MICRO/NANO-REPLICATION
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COST SAVINGS WITH MICRO/NANO-REPLICATION

机译：通过微/纳米复制节省成本

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Micro/Nano-Replication technology, mostly known as Imprinting or Hot/Cold Embossing, offers a cost effective alternative to printing sub-100nm geometries when compared to the costly use of High Resolution Electron Beam lithography imaging.rnWith cost of paramount concern for many new bio and other fluidic applications, polymers are becoming one of the most practical materials for manufacturing. Several replicating techniques are used in the transfer of nano-scale images into a polymer layer. Embossing, stamping, imprinting and molding techniques are used, at wafer level, chip level or larger area level. Both single layer process and multi-layer process (with accurate overlay) are available, providing flexibility to the design engineer.rnJust a few short years ago, micro and nano features seemed unrealistic for markets that demanded low cost production solutions. Today equipment is readily available that caters to the economic requirements for mass production using Micro/Nano-Replication. At wafer level, Cold Embossing is achievable with slight modifications to the proven contact printer aka (also known as) "mask aligner". While Hot Embossing is achieved using a Substrate Bonder, designed to apply precise temperature and force. Both tools have been in use in the development and manufacturing of MEMS and have in applications, such as front-to-back alignment and packaging, enabled the technology. Machines developed for the extreme demand of placement accuracy i.e. optical communications (MOEMS) via device bonding / flip chip bonding are also capable and fully automated for both Cold and Hot Embossing processes.rnThis contribution will review the solutions available today, illustrated with applications of use, then discuss and examine the follow on evolution required to meet future requirements for nanoimprinting at both R&D and production levels.
机译：与高分辨率电子束光刻成像的昂贵使用相比，微/纳米复制技术（通常称为压印或热/冷压印）可提供低于100nm几何形状的低成本印刷方案。在生物和其他流体应用中，聚合物正成为最实用的制造材料之一。几种复制技术用于将纳米级图像转移到聚合物层中。在晶圆级，芯片级或更大面积级使用压印，压印，压印和成型技术。单层工艺和多层工艺（具有精确的覆盖层）都可以使用，从而为设计工程师提供了灵活性。几年前，对于要求低成本生产解决方案的市场来说，微米和纳米功能似乎是不现实的。如今，设备已经可以满足使用Micro / Nano复制技术进行批量生产的经济需求。在晶圆级，只需对经过验证的接触式打印机（也称为“掩模对准器”）进行一些改动，就可以实现冷压花。使用基材粘合机进行热压花时，可以使用精确的温度和力。两种工具均已用于MEMS的开发和制造中，并且已在前后对齐和封装等应用中启用了该技术。为满足对贴装精度的极高要求而开发的机器，即通过设备键合/倒装芯片键合的光通信（MOEMS），也能够用于冷压印和热压印工艺，并且是全自动的。 ，然后讨论并研究在研发和生产水平上满足纳米压印未来需求所需的演变过程。

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