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首页> 外文会议>IMID/IDMC/ASIA DISPLAY 2008;International display manufacturing conference 2008;International meeting on information display;Asia display 2008 >A Robust Process for the Fabrication of Field Emission Backlights
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A Robust Process for the Fabrication of Field Emission Backlights

机译：制造场致发射背光灯的稳健工艺

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摘要

In this paper, we present a novel process for the realization of large area, low cost field emission cathodes. The process makes use of alumina substrates, which are anodically oxidized in order to yield porous structures capable of hosting metal catalyst nanoparticles. By carefully controlling the final stage of the anodisation as well as the electrodeposition conditions, it is possible to fine tune the density of such catalysts in the range of 10~8-10~9cm~2. The catalytic growth of CNTs is subsequently performed at low temperature (～ 600℃ or below, thanks to the use of H_2O), using plasma enhanced chemical vapour deposition. There is no lithography need to make the cathode and current densities of ～ 1mA/cm~2 are easily obtained.
机译：在本文中，我们提出了一种实现大面积，低成本场发射阴极的新颖方法。该方法利用氧化铝基质，其被阳极氧化以产生能够容纳金属催化剂纳米颗粒的多孔结构。通过仔细控制阳极氧化的最后阶段以及电沉积条件，可以在10〜8-10〜9cm〜2的范围内微调此类催化剂的密度。碳纳米管的催化生长随后在低温（〜600℃或以下，由于使用了H_2O）下进行，采用等离子体增强化学气相沉积法。无需使用光刻技术即可制成阴极，并且易于获得〜1mA / cm〜2的电流密度。

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