Dept. of Materials Science and Engineering, Hongik Univ. Seoul, 121-791, Korea;
rnDept. of Materials Science and Engineering, Hongik Univ. Seoul, 121-791, Korea;
rnLTPS Team, AMLCD Business, Samsung Electronics, Yongin-City, Gyeonggi-Do, 449-711, Korea;
rnLTPS Team, AMLCD Business, Samsung Electronics, Yongin-City, Gyeonggi-Do, 449-711, Korea;
rnLTPS Team, AMLCD Business, Samsung Electronics, Yongin-City, Gyeonggi-Do, 449-711, Korea;
rnDept. of Materials Science and Engineering, Hongik Univ. Seoul, 121-791, Korea Phone: 82-2-320-1698, E-mail: jsang@wow.hongik.ac.kr;
reverse annealing; ion implantation; activation;
机译:硼掺杂多晶硅的反向退火
机译:强掺杂多晶硅/氮掺杂硅薄双层中的复杂硼重分布动力学
机译:氮对多晶硅/掺氮硅薄膜热处理过程中硼扩散的影响
机译:硼掺杂多晶硅的反向退火
机译:化学气相沉积硼掺杂多晶金刚石薄膜在硅和蓝宝石上的生长:生长,掺杂,金属化和表征
机译:PECVD对低温生长的掺硼氢化晶体硅的退火
机译:活化退火过程中P +掺杂的多晶硅/氮掺杂的硅双层中硼的复杂分布
机译:硼离子注入激光退火硅的热退火效应