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Stress-strain behavior of Cu-Al-Ni single crystal shape memory alloy at high temperature: Shape Memory Effects

机译:Cu-Al-Ni单晶形状记忆合金在高温下的应力应变行为:形状记忆效应

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The experimental results of a preliminary study on stress-strain behavior of Cu-13.3% Al- 4% Ni (by wt.) single crystal shape memory alloy grown along the direction at high temperatures are given. An Instron testing machine with a high temperature environmental chamber has been used to study the quasi-static stress-strain response of 1.5 mm diameter Cu-Al-Ni single crystal wires at different ambient temperatures in the range 100 - 160℃. Local strain measurements using a highly sensitive extensometer are compared with overall strain measurements computed from the net displacements between grips. The effect of stress cycles on overall strain on full loading, after unloading and after heating in between stress cycles has been discussed.
机译:给出了在高温下沿方向生长的Cu-13.3%Al-4%Ni(重量)单晶形状记忆合金的应力应变行为的初步研究的实验结果。具有高温环境室的Instron测试机已用于研究1.5 mm直径的Cu-Al-Ni单晶线在100-160℃范围内的不同环境温度下的准静态应力-应变响应。将使用高灵敏度引伸计的局部应变测量结果与根据夹具之间的净位移计算出的整体应变测量结果进行比较。讨论了应力循环对总应力的影响,包括在应力循环之间的卸载后和加热后的全负荷。

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