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W/Cu joining strengthened by femtosecond laser induced micron-scale interface structure

机译：飞秒激光诱导的微米级界面结构增强了钨/铜连接

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摘要

W/Cu joining is key for the fabrication of high heat load components for fusion reactors, which however suffers from the low W/Cu bonding strength due to the immiscible nature of W-Cu system. In this study, we proposed a method for strengthened W/Cu joining based on femtosecond (fs) laser induced micron-scale W/Cu interface structure. W surfaces were irradiated by fs laser to form micron-scale cubes array, and then joined to Cu by hot pressing at 1000 °C, 80 MPa for 2.5 hours. The tensile strength of the W/Cu joining samples was investigated. The results show that micron-scale cubes array was successfully introduced into W/Cu interface without any cracks or pores. The interface structure helps to increase the W/Cu bonding strength to as high as 59.61 MPa, increased by about 50% as compared to W/Cu joining with a flat interface (bonding strength 40.11 MPa). The W/Cu bonding strength shows positive correlation with the W/Cu interface area, indicating the possibility to control the W/Cu bonding strength by simply adjusting the fs laser ablation parameters for the fabrication of cubes array on W surface. Our research provides a method for strengthened joining between intrinsically immiscible materials, including but not limited to W and Cu.
机译：W / Cu连接是制造聚变反应堆高热负荷组件的关键，但是由于W-Cu系统的不混溶性，W / Cu连接强度低。在这项研究中，我们提出了一种基于飞秒（fs）激光诱导的微米级W / Cu界面结构的增强W / Cu连接的方法。用fs激光照射W表面以形成微米级的立方体阵列，然后通过在1000℃，80MPa下热压2.5小时而与Cu结合。研究了W / Cu连接样品的拉伸强度。结果表明，微米级立方体阵列已成功引入W / Cu界面，没有任何裂纹或孔洞。界面结构有助于将W / Cu粘合强度提高到59.61 MPa，与具有平坦界面的W / Cu连接（粘合强度40.11 MPa）相比，提高了约50％。 W / Cu键合强度与W / Cu界面面积显示出正相关，表明通过简单地调整fs激光烧蚀参数以在W表面上制造立方体阵列来控制W / Cu键合强度的可能性。我们的研究提供了一种加强内在不混溶材料（包括但不限于W和Cu）之间的结合的方法。

著录项

  • 来源
    《Advanced laser processing and manufacturing》|2016年|1001805.1-1001805.11|共11页
  • 会议地点 Beijing(CN)
  • 作者

    Dafa Jiang; Dingwei Gong; Jiangyou Long; Peixun Fan; Hongjun Zhang; Minlin Zhong;

  • 作者单位

    Laser Materials Processing Research Center, School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China;

    Laser Materials Processing Research Center, School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China;

    Laser Materials Processing Research Center, School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China;

    Laser Materials Processing Research Center, School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China;

    Laser Materials Processing Research Center, School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China;

    Laser Materials Processing Research Center, School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Fs laser ablation; Hot pressing; W/Cu joining; Interface structure; Tensile strength;

    机译：Fs激光烧蚀；热压； W / Cu连接；接口结构；抗拉强度;

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