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首页> 外文会议>American Society of Mechanical Engineers(ASME) Integrated Nanosystems Conference: Design, Synthesis, and Applications; 20050914-16; Berkeley,CA(US) >Flexible Electronic Devices From Hot Embossing Material Transfer
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Flexible Electronic Devices From Hot Embossing Material Transfer

机译：柔性电子设备从热压纹材料转移

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摘要

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing as well as dry transfer techniques. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.
机译：用于柔性电子设备的处理方法的开发被视为用于创建新的半导体产品阵列的使能技术。这些设备具有低成本，一次性使用的潜力，并且可以应用于可变形或非平面的表面。尽管已经在用于柔性器件的非晶硅和有机半导体技术的开发上进行了很多努力，但是半导体纳米材料由于其固有的柔韧性，高传输迁移率以及其独特的光电和压电特性而受到关注。但是，由于这些材料的合成高温或苛刻的化学环境，将这些材料直接合成到聚合物基材上是不可行的。这一挑战限制了具有半导体纳米材料构造块的柔性电子产品的开发。解决制造问题的许多技术包括基于溶液的处理以及干式转移技术。通常，由于减轻了解决基材-流体相容性的需要，所以干转移印刷方法具有优于基于溶液的处理的优点。

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