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ADHESION EFFECTS ON CONTACT OPENING TIME IN MEMS SWITCHES

机译:粘附力对MEMS开关中的触点打开时间的影响

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摘要

Previous models and measurements of MEMS adhesion have focused on steady-state adhesion behavior. This approach is inadequate for micromachined switches (such as RF MEMS switches) because it gives no information about the time required for contact opening, an important specification. We propose a technique to measure the switch opening time and present substantial experimental data for switches with gold-gold contacts. The data demonstrate that contact opening time increases dramatically as contact dimple area increases or as pull-apart force or contact resistance decrease. A model of opening time is also presented with model parameters that fit the experimental data.
机译:MEMS粘附力的先前模型和测量都集中在稳态粘附行为上。这种方法不适用于微机械开关(例如RF MEMS开关),因为它没有提供有关触点断开所需时间的重要信息,触点断开时间很重要。我们提出了一种测量开关断开时间的技术,并提供了具有金-金触点的开关的大量实验数据。数据表明,随着触点凹坑面积的增加或拉力或触点电阻的减小,触点打开时间会急剧增加。还提供了一个开放时间模型,并带有适合实验数据的模型参数。

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