EFFECT OF ADHESION ON WAFER SEPARATION DUE TO TRAPPED PARTICLES

机译：粘附对夹杂颗粒对晶片分离的影响

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Template-based high-rate nanomanufacturing and wafer bonding both rely on surface energy to bring the surfaces into intimate contact. In high-rate nanomanufacturing, unlike wafer bonding, the contacting surfaces must be easily separated after the pressure is removed. A common problem in wafer bonding and nanomanufacturing is particle contamination. Trapped particles cause a separation zone that will prevent the intimate contact required to transfer nanoscale devices from the template to the device wafer. This problem is examined here using two different methods. The first method examines the effect of a rigid particle trapped between elastic plates. The second investigates the effect of a plastically deforming particle trapped between two elastic half-spaces.

机译：基于模板的高速纳米制造和晶圆键合都依赖于表面能使表面紧密接触。在高速纳米制造中，与晶圆键合不同，在去除压力后必须轻松分离接触表面。晶圆键合和纳米制造中的常见问题是颗粒污染。被困住的颗粒会形成一个分离区，该分离区将阻止将纳米级器件从模板转移到器件晶圆所需的紧密接触。这里使用两种不同的方法检查此问题。第一种方法检查刚性颗粒在弹性板之间的影响。第二部分研究了陷在两个弹性半空间之间的塑性变形颗粒的影响。

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《American Society of Mechanical Engineers(ASME)/Society of Tribologists and Lubrication Engineers(STLE) International Joint Tribology Conference; 20071022-24; San Diego,CA(US)》|2007年|P.42|共1页
会议地点 San DiegoCA(US)
作者
Andy Pamp; George G. Adams;
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作者单位

Mechanical and Industrial Engineering Northeastern University;

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原文格式 PDF
正文语种 eng
中图分类机械摩擦、磨损与润滑;
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机译：STI和Poly Si CMP中晶片表面的二氧化硅和二氧化铈颗粒的粘附和去除
2. Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP [J] . Yi Koan Hong, Young-Jae Kang, Jin-Goo Park, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2008,第0期

机译：STI和Poly Si CMP中晶片表面的二氧化硅和二氧化铈颗粒的粘附和去除
3. Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP [J] . Yi-Koan Hong, Ja-Hyung Han, Jin-Hyung Lee, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2005,第0期

机译：Cu CMP中硅片表面氧化铝浆料的附着与去除
4. EFFECT OF ADHESION ON WAFER SEPARATION DUE TO TRAPPED PARTICLES [C] . Andy Pamp, George G. Adams American Society of Mechanical Engineers/Society of Tribologists and Lubrication Engineers International Joint Tribology Conference . 2007

机译：粘附对截面粒子晶片分离的影响
5. Submicron particle adhesion and removal in chemical mechanical polishing and wafer cleaning processes. [D] . Zhang, Fan. 1999

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6. Detailed mechanics of membrane-membrane adhesion and separation. II. Discrete kinetically trapped molecular cross-bridges. [O] . E. A. Evans 1985

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7. Separation on velocities of the particles trapped in self-consistent Malmberg-Penning trap [O] . Tarasov I.K., Maslov V.I., Tarasov M.I., 2005

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8. Trapped Particle Instability and Flute Instability in Tandem Mirror; Scale Separation Closure in Alfven Wave Turbulence [R] . Chen, C. 1988

机译：串联镜中的陷阱粒子不稳定性和长笛不稳定性; alfven波湍流中的尺度分离闭合

EFFECT OF ADHESION ON WAFER SEPARATION DUE TO TRAPPED PARTICLES

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