INVESTIGATING THE EFFECT OF POWER DISTRIBUTION ON COOLING A DOUBLE-SIDED PCB: NUMERICAL SIMULATION AND EXPERIMENT

机译：研究配电对冷却双面印刷电路板的影响：数值模拟和实验

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An experimental procedure for investigating the effect of power distribution on the cooling of a double-sided PCB is implemented. A number of computational fluid dynamics (CFD) models are validated by laboratory experiments performed in 19.5℃ temperature environment. Case temperatures of surface-mounted components fully populating the PCB sides are measured and monitored in simulations. Different combinations of power distribution with other cooling methods, such as a heatsink tooled on a sealed or open enclosure, at natural or forced convection, are studied. Thermally efficient uniform and non-uniform power configurations are determined on a double sided PCB. It is concluded that managing power distribution on a double-sided PCB can be considered as a measure to improve the thermal performance of electronic modules.

机译：实施了实验程序，以研究功率分配对双面PCB散热的影响。通过在19.5℃温度环境下进行的实验室实验验证了许多计算流体动力学（CFD）模型。在仿真中测量并监视完全安装在PCB侧面的表面安装组件的外壳温度。研究了自然分配或强制对流下功率分配与其他冷却方法（例如安装在密封或开放式外壳上的散热器）的不同组合。在双面PCB上确定热效率均匀和不均匀的电源配置。结论是，可以将管理双面PCB上的电源分配视为改善电子模块热性能的一种措施。

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来源
《American Society of Mechanical Engineers(ASME) Summer Heat Transfer Conference(HT2005); 20050717-22; San Francisco,CA(UA)》|2005年|P.649-657|共9页
会议地点 San FranciscoCA(UA)
作者
Jonas Johansson; Ilja Belov; Peter Leisner;
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作者单位

SaabTech AB, Box 1017, SE 551 11, Joenkoeping, Sweden;

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会议组织
原文格式 PDF
正文语种 eng
中图分类热力工程理论;
关键词
double-sided PCB; power distribution; temperature measurement; CFD simulations; model validation;

机译：双面PCB;配电;温度测量; CFD模拟;模型验证;

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INVESTIGATING THE EFFECT OF POWER DISTRIBUTION ON COOLING A DOUBLE-SIDED PCB: NUMERICAL SIMULATION AND EXPERIMENT

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