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首页> 外文会议>Annual Symposium on Quantitative Nondestructive Evaluation; 19980719-24; Snowbird,UT(US) >DEFECT DETECTION IN WIRE MANUFACTURING
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DEFECT DETECTION IN WIRE MANUFACTURING

机译：电线制造中的缺陷检测

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The original goal of finding inclusions in current-carrying Al wires by using a SQUID magnetometer clearly is compromised by the appearance of much larger signals which seem most likely caused by minute deviations from linearity in these wires. Based on the amplitude of the magnetic signals, it is estimated that the deviations are in the range of 200 nm to 2 μm, much too small to be observable visually. This conclusion is reached on the basis of a number of factors. Surface quality and purity have been ruled out as factors, since inclusion, it was decided to drill holes of various sizes in some wires as a means of simulating inclusions. Holes of 8 to 12 mils (0.2 to 0.3 mm) were drilled into a taut 20-mil Cu wire. Measurements carried out using the setup of Figure 1 failed to yield any conclusive evidence of the presence of these holes. This confirmed the belief that the standoff of 1 cm or greater (in the apparatus of Figure 1) prevented the detection of defect structures of 0.3 mm or less. Rather than wait for the construction of a special dewar which would have lowered the standoff to between 1 and 2 mm, selected wires were taken to the University of California at Berkeley (UCB) for measurement in a scanning SQUID microscope. While the instrument at UCB offers a 1-mm standoff, it is limited to a scanning area of 3x3 cm~2. While not currently configured to accept long lengths of wire being spooled over the inverted SQUID system, it was more than adequate to resolve a magnetic anomaly due to the injected current intersecting the holes in the Cu wires. The results of one such measurement are shown in Figure 6, in which the presence of a 0.3-mm (partial) hole in a 0.5-mm diameter wire is apparent.
机译：通过使用SQUID磁力计在载流铝线中寻找夹杂物的最初目标明显受到更大信号的出现的损害，这似乎很可能是由于这些线的线性偏差引起的。根据磁信号的幅度，估计偏差在200 nm至2μm的范围内，太小而无法从视觉上观察到。这个结论是根据许多因素得出的。由于夹杂物的存在，已经排除了表面质量和纯度的因素，因此决定在某些金属丝上钻各种尺寸的孔，作为模拟夹杂物的一种方法。将8到12密耳（0.2到0.3毫米）的孔钻入一条20密耳的紧铜丝中。使用图1的设置进行的测量未能得出存在这些孔的任何确凿证据。这证实了以下信念：1厘米或更大的间距（在图1所示的设备中）阻止了0.3毫米或更小的缺陷结构的检测。与其等待特殊的杜瓦瓶制造，该杜瓦瓶将支架的间距降低到1到2毫米之间，不如将选定的导线带到加州大学伯克利分校（UCB），以便在扫描SQUID显微镜下进行测量。尽管UCB的仪器提供了1mm的支架，但它的扫描区域仅限于3x3 cm〜2。尽管目前尚未配置为接受在反SQUID系统上绕制的较长长度的导线，但由于注入的电流与Cu导线中的孔相交，因此足以解决磁异常。一种这样的测量结果如图6所示，其中明显可见直径为0.5毫米的导线中存在0.3毫米（部分）孔。

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