首页> 外文会议>Annual Symposium on Quantitative Nondestructive Evaluation; 19980719-24; Snowbird,UT(US) >INSTRUMENTATION DEVELOPMENT FOR CRACK DETECTION OF SURFACE AND SUBSURFACE DEFECTS IN GREEN-STATE P/M COMPACTS THROUGH MULTIPROBE ELECTRIC RESISTIVITY TESTING
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INSTRUMENTATION DEVELOPMENT FOR CRACK DETECTION OF SURFACE AND SUBSURFACE DEFECTS IN GREEN-STATE P/M COMPACTS THROUGH MULTIPROBE ELECTRIC RESISTIVITY TESTING

机译:通过多探针电阻率测试在绿色状态P / M压块检测裂纹和表面缺陷的仪器开发

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摘要

A new instrumentation approach has been presented which exploits an electrostatic change in resistivity as an indicator of flaws in green-state P/M compacts. The inspection process relies on a novel planar multi-pin sensor head of 100 contacts that are simultaneously brought in contact with the sample. The hardware processing of the voltage signals and the subsequent software evaluation shows excellent ability to determine defective compacts in a wide range of material compositions. The defects can be either surface-breaking or subsurface with sizes as small as 20 microns. A number of tests with controlled and production compacts have underscored the success of this instrumentation approach.
机译:提出了一种新的仪器方法,该方法利用电阻率的静电变化作为生坯P / M压块缺陷的指示器。该检查过程依赖于具有100个触点的新型平面多针传感器头,该触点同时与样品接触。电压信号的硬件处理和随后的软件评估显示出出色的能力,可以确定各种材料成分中的压坯。缺陷可以是表面破裂的,也可以是尺寸小于20微米的亚表面缺陷。使用可控紧凑型和生产紧凑型的许多测试强调了这种仪器方法的成功。

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