Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond

机译：单点金刚石刻划的硅晶圆的拉曼分析

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This paper presents a Raman analysis of the monocrystalline silicon wafer scratched by single point diamond. Si-Ⅲ and Si-Ⅻ phases are found to be existence in the scratched silicon surface, which is the result of the phase transformation. A mathematical model was developed to calculating the molar concentration of phase of the silicon. Based on the mathemathical model, the relationship between the molar concentrations of the Si-Ⅰ phase and the applied load was analysied.

机译：本文介绍了单点金刚石刮擦的单晶硅晶片的拉曼分析。发现Si-Ⅲ相和Si-Ⅻ相存在于划痕的硅表面中，这是相变的结果。建立了数学模型以计算硅相的摩尔浓度。基于数学模型，分析了Si-Ⅰ相的摩尔浓度与外加载荷之间的关系。

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来源
《Application of diamond and related materials》|2010年|p.82-86|共5页
会议地点 Xiamen(CN);Xiamen(CN);Xiamen(CN);Xiamen(CN)
作者
Zhuo Chen; Xin Wei; Xiaozhu Xie; Qinglei Ren;
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作者单位

Guangdong University of Technology, Guangzhou, China;

Guangdong University of Technology, Guangzhou, China;

Guangdong University of Technology, Guangzhou, China;

Guangdong University of Technology, Guangzhou, China;

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会议组织
原文格式 PDF
正文语种 eng
中图分类工程材料一般性问题;
关键词
silicon wafer; diamond; raman;

机译：硅片钻石;拉曼;

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专利

1. Raman analysis of the silicon wafer scratched by single point diamond [J] . Chen Z., Wei X., Xie X., Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2011,第Null期

机译：单点金刚石刮擦的硅片的拉曼分析
2. Enhanced thermal performances of silicon-on-diamond wafers incorporating ultrathin nanocrystalline diamond and silicon layers: Raman and micro-Raman analysis [J] . Jean-Paul Mazellier, Michel Mermoux, Francois Andrieu, Journal of Applied Physics . 2011,第8期

机译：结合了超薄纳米晶金刚石和硅层的金刚石硅晶片的增强的热性能：拉曼和微拉曼分析
3. Changes in surface layer of silicon wafers from diamond scratching [J] . Zhang Zhenyu, Wang Bo, Kang Renke, CIRP Annals . 2015,第1期

机译：金刚石刮擦导致硅晶片表面层的变化
4. Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond [C] . Zhuo Chen, Xin Wei, Xiaozhu Xie, Conference on Application of Diamond and Related Materials in China . 2011

机译：由单点钻石划伤的硅晶片的拉曼分析
5. Thermal conductivity of diamond thin-films on silicon wafers [D] . Harrup, Marshall 2015

机译：硅晶片上金刚石薄膜的热导率
6. The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw [O] . Tengyun Liu, Peiqi Ge, Wenbo Bi 2021

机译：用树脂粘合金刚石锯锯制线速对相变硅晶片中的相变和残余应力的影响
7. Lattice Strain in the Scratched Silicon Single Crystal Wafer and Stress Relaxation due to Anealing [O] . 砂田淳二, SUNADA Junji 1980

机译：划痕的硅单晶晶片中的晶格应变和退火引起的应力松弛

Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond

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