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首页> 外文会议>Applications of Photonic Technology: Closing the Gap between Theory, Development, and Application 7C-Photonics North 2004: Photonic Applications in Telecommunications, Sensors, Software, and Lasers pt.2 >Thermal modeling of a GaAs-hased Mach-Zehnder modulator integrated with a MMIC broad-band driver amplifier
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Thermal modeling of a GaAs-hased Mach-Zehnder modulator integrated with a MMIC broad-band driver amplifier

机译：集成了MMIC宽带驱动器放大器的GaAs专用Mach-Zehnder调制器的热模型

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摘要

This paper presents a thermo-mechanical analysis of an optoelectronic system including a Mach-Zehnder (MZ) optical modulator integrated with a broad-band GaAs driver amplifier, forming a module which then is placed into a low temperature co-fired ceramic (LTCC) substrate. All module connections such as voltage supply, RF signals and fiber optic input/output are realized through the LTCC. Thermal analysis of this integrated system shows elevated temperatures in the optical component caused by the heat generated in the power amplifier and dissipated into the substrate-carrier and from there into the LTCC. Temperature profiles along the MZ modulator reveal a strong non-uniformity, reaching a 26℃ temperature difference between the optical component input and output. A stress-strain analysis is also performed. Preliminary results show significant physical distortion of the optical component, which could cause optical misalignments and additional coupling losses. These findings indicate a need for thermal consideration in early design stages.
机译：本文介绍了一个光电子系统的热机械分析，该光电子系统包括一个与宽带GaAs驱动放大器集成在一起的Mach-Zehnder（MZ）光调制器，形成一个模块，然后将该模块放入低温共烧陶瓷（LTCC）中基质。所有模块连接（例如电源，RF信号和光纤输入/输出）均通过LTCC实现。该集成系统的热分析表明，功率放大器中产生的热量会散发到基板载体中，再从那里散发到LTCC中，从而导致光学组件的温度升高。沿着MZ调制器的温度曲线显示出很强的不均匀性，光学组件输入和输出之间的温度差达到26℃。还进行了应力应变分析。初步结果表明，光学组件存在明显的物理变形，这可能导致光学失准和额外的耦合损耗。这些发现表明在早期设计阶段需要考虑散热。

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