Polystyrene-Silver composites for embedded capacitor applications

机译：嵌入式电容器应用的聚苯乙烯-银复合材料

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The present paper reports the preparation and characterization of Polystyrene-Silver composites for embedded capacitor applications. The composites have been prepared by ultrasonic mixing followed by hot pressing. The percolation threshold is found to be decreasing from 0.1 Vf for silver of particle size < 250 µm to 0.07 Vf for nano silver. The composites have temperature stable relative permittivity.

机译：本文报道了用于嵌入式电容器应用的聚苯乙烯-银复合材料的制备和表征。通过超声混合然后热压来制备复合材料。发现渗透阈值从粒径<250 µm的银的0.1 Vf降低到纳米银的0.07 Vf。该复合材料具有温度稳定的相对介电常数。

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来源
《Applied Electromagnetics Conference (AEMC), 2011 IEEE》|2011年|p.1- 4|共4页
会议地点 Kolkata(IN)
作者
Thomas Dhanesh; Sreelakshmi K. P.; Manu K. M.; Sebastian M. T.;
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Materials Division, National Institute for Interdisciplinary Science and Technology, Trivandrum 695 019, Kerala, India;

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原文格式 PDF
正文语种 eng
中图分类通信;
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Polystyrene-Silver composites for embedded capacitor applications

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